Experimental Thermodynamics and Surface Properties of Ag-Cu-Ge Solder/Braze Alloys

Abstract

Ag-based alloys have industrial importance in relation to their use as high-temperature solders in jewellery or braze alloys for thermoelectric modules. Good wetting properties and a tarnish-resistance of Ag-Ge and Ag-Cu-Ge alloys together with appropriate mechanical properties make them good candidates for bonding sterling silver (Ag-7.5Cu, in wt.%). The melting temperature and the heat of melting of Ag-Cu, Ag-Ge and Ag-Cu-Ge eutectic alloys have been measured by differential scanning calorimetry. From a technological point of view, particular attention should be paid to the surface tension, a key property of the joining processes. The aim of this study is to correlate the thermodynamic properties of the Ag-Cu-Ge system and its subsystems with their surface properties and to compare the model predicted property values to the data available in the literature.