Experimental Study on Thermal Performance of a Bent Copper-Water Heat Pipe

Shuangshuang Miao,Yulong Zhang,Xiangdong Liu,Feng Yao,Jiajia Sui

doi:10.1155/2020/8632152

Abstract

Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components. The copper-water bent heat pipes are particularly suited to the circumstances of confined space or misplaced heat and cold sources for high-heat-flux electronic components. In this paper, the steady and transient thermal performance of a bent copper-water heat pipe is studied based on a performance test system. The effects of cooling temperature, working conditions on the critical heat flux, and equivalent thermal conductivity have been examined and analyzed. Moreover, the influences of heat input and working conditions on the thermal response of a bent heat pipe have also been discussed. The results indicate that the critical heat flux is enhanced due to the increases in cooling temperature and the lengths of the evaporator and condenser. In addition, the critical heat flux is improved by extending the cooling length only when the operating temperature is higher than 50°C. The improvement on the equivalent thermal by increasing the heating length is more evident than that by increasing cooling length. It is also demonstrated by the experiment that the bent copper-water heat pipe can respond quickly to the variation of heat input and possesses superior transient heat transfer performance.

Highlights

In the last decade, with the rapid development of microelectronic technology, there is an irreversible development trend towards to the high integration, miniaturization, and high power for the electronic components [1,2,3,4]
The results indicate that the working medium in the bent heat pipe can keep circulating, and the thermal performance of the bent heat pipe keeps reliable even in a rotating state
When the heat input of the bent heat pipe reaches a specific threshold value, a small amount heat input increment ΔQ will cause a sudden rise in the wall temperature at the hot end of the evaporator section, which means that the evaporation section is partially or completely dry out attributing to the absence of backflow liquid

Summary

Introduction

With the rapid development of microelectronic technology, there is an irreversible development trend towards to the high integration, miniaturization, and high power for the electronic components [1,2,3,4]. Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components [5,6,7], because excessive temperature leads to the unstable working status and shortens the life of electronic components, resulting in a decrease in system reliability [8, 9]. The heat pipe has already been widely applied in thermal control systems owing to high thermal conductivity and superior isothermal properties. It has been a hotpot in the research area of heat transfer enhancement

Methods

Results

Conclusion