Abstract
Highly dense and integrated data centers face key challenges of realizing efficient cooling and improved energy efficiency. To overcome these challenges, this study experimentally investigated the flow and heat transfer characteristics of single-phase immersion liquid cooling (SPILC) systems. The influence of two opposite coolant flow directions on the SPILC performance was examined. Furthermore, a correlation mechanism between coolant thermal properties and SPILC performance was established, along with a control chart for regulating the working conditions of SPILC systems. The results indicate that compared to a pro-gravity flow, an anti-gravity flow scheme reduces the chip case temperature and thermal resistance by 33.8% and 55.6%, respectively, while decreasing the power usage effectiveness (PUE) by 1.4%. Using coolant with the lowest viscosity reduces the chip case temperature and thermal resistance by 9.3% and 10.5%, respectively, while decreasing the PUE by 0.4%. Moreover, the cooling water temperature has a greater impact on the performance of SPILC systems than the volume flow rate of coolants. Additionally, this paper provides control charts for the cooling water temperature and coolant flow rate to improve the PUE while ensuring the safe operation of SPILC systems, with the highest chip temperature and total electricity consumption as indicators.
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