Abstract

A lightly doped P-well field-limiting rings (FLRs) termination on 4H-SiC vertical double-implanted metal-oxide-semiconductor field-effect transistors (VDMOSFETs) has been investigated. Based on the simulation, the proposed termination applied to 4H-SiC VDMOSFET could achieve an almost same breakdown voltage (BV) and have the advantage of lower ion-implantation damage comparing with P+ FLRs termination. Meanwhile, this kind of termination also reduces the difficulty and consumption of fabrication process. 4H-SiC VDMOSFETs with lightly doped P-well (FLRs) termination have been fabricated on 10μm thick epi-layer with nitrogen doping concentration of 6.2×1015cm−3. The maximum breakdown voltage of the 4H-SiC VDMOSFETs has achieved as high as 1610V at a current of 15μA, which is very close to the simulated result of 1643V and about 90% of the plane parallel breakdown voltage of 1780V. It is considered that P-well FLRs termination is an effective, robust and process-tolerant termination structure suitable for 4H-SiC VDMOSFET.

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