Abstract
Experiments were conducted to study the flow and heat transfer characteristics of a natural circulation cooling system for electronic components. The test loop consisted of a horizontal test section, a horizontal evaporator, a vertical tube, a horizontal condenser, a rubber bag attached at the exit of condenser, a downcomer, a mass flow meter, and a liquid cooler. The loop height H was set at 250 and 450 mm. In the test section, a silicon chip with dimensions of 10×10×0.5 mm3 was attached at the bottom of a horizontal duct with dimensions of 10×14 mm2.A smooth chip and five chips with square micro-pin-fins were tested. For each H, the average flow rate of FC-72 was correlated well as a function of the static head difference between the two vertical tubes. The heat transfer results were compared with those for pool boiling.All chips showed the boiling curve similar to the case of pool boiling except that the critical heat flux was about 20% lower than that for pool boiling.
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