Experimental Study on Interconnected Structures Failure of Electronic Packaging Under Vibration Load

Abstract

In order to effectively acquire the comparable vibration degradation test data of interconnection structures in electronic packaging, problems which may exist in the reliability test of electronic packaging are analyzed in depth, using the existing environmental testing standards and combining with the accumulated experience in practical electronic reliability experiments. A complete set of degradation test methods for vibration failure of interconnected structures was proposed. This method can give a complete solution for the failure test of the interconnection structure in electronic packaging. Analysis of experimental data shows that the test data can well characterize the degradation process of the interconnected structures, and the outside interconnection structures in electronic packaging are easier to fail than the inside interconnection structures. The experimental method can effectively guide the implementation of the degradation test in the field of electronic interconnected structures in electronic packaging.