Experimental study on heat transfer of plate pulsating heat pipe with channels of different diameters at the evaporating and condensation ends and channels connected at the evaporating end

Abstract

To solve the heat dissipation of electronic chips with high heat flux density and cramped space, the parallel channel of this “new heat pipe” underwent a transformation in evaporating and condensation ends with different axial diameters and evaporating ends with the radial connection. Taking the filling rate, inclination angle, and heating power as independent variables, the heat transfer performance of the new heat pipe is further studied and compared with that of the traditional heat pipe. Finally, the following conclusions are drawn: the optimal liquid filling rate of the new heat pipe is 14%, and the optimal inclination angle is 90°C; the new heat pipe's equivalent thermal conductivity is 18,004 W/(m·°C) at a wind speed of 2.0 m/s and heating power of 15 W, which is 73.3% higher than the parallel channel plate pulsating heat pipe. In general, the heat transfer performance of the new heat pipe has been greatly improved compared with the traditional heat pipe.