Abstract
Because of the many advantages of high-precision micromachining, picosecond pulsed lasers (PSPLs) can be used to process chemical-vapor-deposited diamonds (CVD-D). With the appropriate PSPL manufacturing technique, sharp and smooth edges of CVD-D micro tools can be generated. In this study, a PSPL is used to cut CVD-D. To optimize PSPL cutting, the effects of its parameters including fluence, pulse pitch, and wavelength on the cutting results were investigated. The results showed that the wavelength had the greatest impact on the sharpness of CVD-D. With PSPL cutting, sharp cutting edges, and smooth fabricated surfaces of the CVD-D, micro tools were achieved. Finally, the fabrication of CVD-D micro milling tools and micro milling experiments were also demonstrated.
Highlights
The hardness, molar density, thermal conductivity, bulk elastic modulus, and acoustic velocity of diamonds are higher than other natural materials, and its compressibility is lower than other materials
Compared to single crystal diamond (SCD), isotropic chemical-vapor-deposited diamond (CVD-D) cannot cleave along the crystal plane, which severely restricts the use of SCD
The optimization of picosecond pulsed laser cutting of CVD-D micro tools was implemented with the single factor test and variance analysis
Summary
The hardness, molar density, thermal conductivity, bulk elastic modulus, and acoustic velocity of diamonds are higher than other natural materials, and its compressibility is lower than other materials. The diamond has a very low thermal expansion coefficient of 0.8 × 10−6 at 293 K [1] and excellent optical and electrical properties. Because of the scarcity of natural diamonds, synthetic diamonds have become important. Synthetic diamonds can be classified into many types. The chemical-vapor-deposited diamond (CVD-D), poly-crystalline diamond (PCD), and single crystal diamond (SCD) are the most widely used types in industry. Compared to PCD, CVD-D is harder and exhibits a lower friction coefficient, higher abrasion resistance, higher thermal conductivity, and better chemical and thermal stability. Compared to SCD, isotropic CVD-D cannot cleave along the crystal plane, which severely restricts the use of SCD
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