Abstract
The heat sinks are used to dissipate heat from electronic and industrial systems. In the present study, in order to overcome limitation of traditional heat sink, we suggest and experimentally investigate new concept of heat sink which use evaporation of water. The heat sink is made from sintered copper plate and absorbs supplied water like sponges by capillarity-driven wetting. The absorbed water evaporates at the surface of heat sink and the surface temperature is dropped due to the latent heat of water evaporation. In this study, we experimentally compare the heat dissipation performance of the suggested heat sink with traditional heat sink. And we investigate the performance of heat sink made from the sintered copper plate with various particle radius and porosities. Finally, we find the fin spacing, at which the thermal performance is maximized.
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