Abstract
The curing process of epoxy resin was monitored real-time by using embedded fiber Bragg grating (FBG) sensor. The resin was cured at room temperature 24°C for 24 hours. The curing monitor test showed that the temperature inside the resin went up quickly at the first 70 minutes. Then the temperature increased slowly till 120 minutes. Afterward, the central wavelength decreased which indicated two stage of curing, i.e. temperature reduction and curing shrinkage. Furthermore, the cured resin sample under tensile load was studied. Strain gauges were applied in order to evaluate the FBG sensor. Experimental results showed that difference existed between the mentioned sensors.
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