Abstract
An experimental investigation of the jet nanofluids impingement heat transfer characteristics of mini-channel heat sink for cooling computer processing unit of personal computer is performed. The experiments are tested under the real personal computer operating conditions: no load and full load conditions. The experiments are performed for the following ranges of the parameters: coolant flow rate varies from 0.008 to 0.020 kg/s, the nozzle diameter is set to 1.00, 1.40, 1.80 mm, the distance nozzle-to-fins tip is 2.00 mm, the channel width of the mini-channel heat sink is 1.00 mm. The nanofluids with suspending of TiO2 particles in base fluid are used as a working fluids. It was observed that the average CPU temperatures obtained from the jet nanofluids impingement cooling system are 3.0%, 6.25% lower than those from the jet liquid impingement and from the conventional liquid cooling systems, respectively. However, this cooling system requires higher energy consumption.
Highlights
In order to ensure reliable operation, the personal computer (PC) or electronics devices must be operated in the specific temperature ranges which the exceeding maximum allowable temperature is the serious problem of these devices
The nanofluids were pumped into the mini-rectangular fin heat sink which installed on the computer processing unit (CPU) of PC in the normal direction with the base bottom as shown on Figure 2 and returned to the storage tank
The reason for this is because a larger coolant flow rate results in higher heat transfer rate and lower CPU temperature
Summary
In order to ensure reliable operation, the PCs or electronics devices must be operated in the specific temperature ranges which the exceeding maximum allowable temperature is the serious problem of these devices. The development of the miniaturized technology, mini and micro-components has been introduced as one of heat transfer enhancement techniques. The study of a single phase heat transfer of the various geometrical heat sinks for cooling electronic devices are reported by Zhange et al.,[1]; Yu [2]; Peles [3]; Kosar and Peles [4]; Yakut et al [5]; Mohamed [6]. Jeng and Tzeng [9] experimentally studied the pressure drop and heat transfer of a square pin-fin array. These studies indicated that the various geometrical heat sinks are possible for cooling electronics devices
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