Abstract
This work deals with heat transfer resulting from the operation of power electronic components. Heat is removed from the mounting plate, which is the evaporator of the loop thermosyphon to the condenser and by natural convection is transferred to ambient. This work includes proposal of cooling device - loop thermosyphon, with its construct and follow optimization of cooling effect. Optimization proceeds by selecting the quantity of working fluid and selection of diameters vapour line and liquid line of loop thermosyphon.
Highlights
$EVWUDFW This work deals with heat transfer resulting from the operation of power electronic components
Heat is removed from the mounting plate, which is the evaporator of the loop thermosyphon to the condenser and by natural convection is transferred to ambient
The cooling device has been designed as a specific type of thermosyphon - loop thermosyphon whose operation depends on the position of the evaporation and condensation section
Summary
The cooling device has been designed as a specific type of thermosyphon - loop thermosyphon whose operation depends on the position of the evaporation and condensation section. $EVWUDFW This work deals with heat transfer resulting from the operation of power electronic components. Heat is removed from the mounting plate, which is the evaporator of the loop thermosyphon to the condenser and by natural convection is transferred to ambient.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.