Experimental study of flat plate micro heat pipe with multi-layer structured wick

Abstract

With the increased requirement of heat dissipation in the microelectronics field, the study of Flat plate Micro-Heat Pipe (FMHP) has become a hot topic. In this work, by analyzing the characteristics of the gas–liquid two-phase flow cycle within the FMHP, a Multi-Layer structured wick FMHP (MLHP) was prepared and used to improve the heat dissipation efficiency of microelectronic devices. The performance test system was set upto measure the heat transfer performance of the MLHP at different thermal powers and different liquid filling rates. The experimental results show that the MLHP of 150% filling rate can operate stably under 22 W thermal power, and it has an operating thermal resistance of 0.44[Formula: see text]C/W. The liquid filling rate has a significant effect on the thermal performance of the MLHP. Around the suitable filling rate, the MLHP has sufficient working fluid inside and low resistance to vapor flow. Under the high thermal power, the advantages are more significant.