Abstract
A novel variant of thermal laser dicing of crystalline silicon has been studied in this paper, by using fluid assistance to improve the reliability, flexibility and operational window of the current process. High quality laser cutting of monocrystalline and polycrystalline silicon is demonstrated by using a diode laser focused on a 1 mm spot, assisted with the use of a water or glycerol layer, and resulting in Zero Kerf cuts with low total roughness and enabling freeform cutting.
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