Experimental study of diamond ablation based on femtosecond laser

Abstract

A femtosecond laser with repetition frequency of 1 kHz, pulse width of 104 fs and center wavelength of 800 nm was used to study the influence of laser average power and laser machining time on the size, depth and surface quality of diamond ablative machining points. The experimental results show that when the laser power is less than 150 mW and laser ablation processing time is 100 ms, the diamond is mainly weakly ablated, the ablative depth is shallow, the ablative processing point size is small, the laser ablative removal efficiency is low, the edge of the ablative processing point is neat, and the processing quality is good; When the laser power is greater than 150 mW and laser ablation processing time is 100 ms, the diamond is mainly strongly ablative, the ablative depth is deep, the ablative processing point is large, and the ablative area is easy to form Latent heat leads to poor edge integrity of laser ablation processing points and poor ablation processing effect. When the processing time is less than 200 ms and the laser power is fixed at 100 mW, the laser ablation depth increases with the increase of processing time; when the processing time is more than 200 ms and the laser power is fixed at 100 mW, the ablation depth slows down with the deepening of ablation depth, and finally tends to a limit depth. When the laser power exceeds the ablation threshold and the laser processing time is greater than a certain value, there is no significant change in the size of the processing point.