Abstract
This paper describes an experimental study of the fabrication of micro-mechanisms on a silicon wafer. Planar process technology developed in the industry of CMOS LSI was employed. The structural material is CVD-polycrystalline silicon with a thickness of 2.5 μm and the sacrificial material is CVD-SiO2 with a thickness of 1.0 μm. In the experimental study, micro-rotors with a shaft and a cap in an assembled form were fabricated on a silicon wafer. The self-alignment process gave a tolerance of 1.0 μm between the rotor and the shaft. The maximum rotation speed observed was 9 x 104 rpm by blowing nitrogen gas.
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