Abstract
In this subject, thermosonic flip-chip technology was introduced to conduct low-temperature bonding of Ag paste and chip interconnection experiments with micro solder joints. The coating and printing method is used to realize the uniform coating of the Ag paste on the micro Cu pillars, and the thickness of the coated Ag paste can be controlled. During flip-chip bonding, different power, pressure, temperature, and bonding time will affect the shear resistance of the solder joint after bonding. Therefore, this article controls the above factors and only studies the impact of ultrasonic power and pressure on the shear force of the solder joint interface. The experiment found that before reaching the maximum shear force, as the ultrasonic power increases, the shear resistance of the solder joint also gradually increased. After that, as the ultrasonic power increased, the shear resistance of the solder joints gradually decreased. It shows that when using thermosonic flip-chip technology for chip bonding, the ultrasonic power should be maintained in an appropriate range to make the bonded flip-chip solder joints obtain a maximum shear strength. The bonding pressure is proportional to the shear strength of the solder joint.
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