Experimental Research on the Supply of Working Fluid for Fixed Diamond Wire Slicing Based on Ultrasonic Capillary Effect.

Abstract

Thin wafers and thin wires are beneficial to the photovoltaic industry for reducing costs, increasing efficiency, and reducing the cost of electricity generation. It is a development trend in solar silicon wafer cutting. Thin wire cutting reduces the kerf between silicon wafers to less than 50 μm. Therefore, it is extremely difficult to supply cutting fluid to the cutting area. And this affects cutting performance. This paper proposes the use of the capillary effect produced by ultrasonic waves in fixed diamond wire slicing to improve the cutting fluid supply and reduce wafer adsorption. To explore the rules of ultrasonic capillary action between two plates and guide the industrial applications, the effects of the distance between parallel plates, the distance from the bottom of the parallel plates to the ultrasonic radiation surface, the non-parallelism between the plates, the temperature of the working fluid, the ultrasonic action time, and the type of working fluid on the liquid level rise height were studied. The conclusions can be used to guide the improvement of the supply of working fluid in fixed diamond wire slicing.