Abstract
This paper presents an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging. The first capillary structure is that of axial grooves manufactured by wire electrical discharge machining (wire-EDM). The sintering process with copper powder produced the second heat pipe. Finally, a hybrid heat pipe was made by the combination of the two previous methods. The heat pipes were produced using copper tubes with an outer diameter of 9.45 mm and a length of 200 mm, and were tested horizontally at increasing heat loads varying from 5 to 35 W. The working fluid used was distilled water. The experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable. Nonetheless, the hybrid heat pipe is the best, due to the lowest thermal resistance presented.
Highlights
The experimental results regarding the thermal behavior of the heat pipes with different capillary structure technologies operating in the horizontal position are presented here
In the grooved heat pipe, the adiabatic temperature reaches a stable behavior at 20 W, and the separation of the Tcond,3 and Tcond,4 thermocouples at 30 and 35 W is probably due to the presence of non-condensable gases inside the grooved tube
This paper presented an experimental study of three heat pipes with different capillary structure technologies for application to the thermal management of electronic packaging
Summary
Due to the innovation of modern electronic technology, the thermal systems miniaturization and the consequent rapid increase in the power density of advanced microprocessors and electronic components created a significant demand for achieving high heat dissipation rates (Nishida & Alves, 2014). In most cases, such high heat fluxes cannot be dissipated using existing cooling techniques, directly affecting the performance, cost, and reliability of devices (Wang, Yao, Shi, Wu, & Zhang, 2018). According to Faghri (2014), heat pipes are highly effective passive devices for transmitting heat at high rates over considerable distances with small temperature decrease, flexibility, simple construction, and easy control with no external pumping power
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