Abstract
As the computer systems process data more rapidly, large amounts of heat are generated in very small areas. Thermal management of the central processing unit has become crucial to avoid malfunction and failure of critical hardware. A thermoelectric cooling (TEC) system is proposed to remove the heat that is generated by electronic device in this paper. To improve the performance of this system, a gravity assistant heat pipe (GAHP) is attached on the hot side of the thermoelectric cooling module, serving as a heat sink. A mathematical model of heat transfer, based on the energy conservation, is established for the integrated system. A prototype is designed, built and tested in a climatic chamber under various conditions, comparing with a TEC system with air cooling heat sink. It is found that the cooling capacity is improved by approximately 73.54% and the electricity consumption was reduced by 42.20% to produce the same amount of cold energy.
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