Experimental Investigation on Heat Transfer Characteristics of Different Metallic Fin Arrays

Abstract

The reliability of electronic equipment depends on the reliability of the system. For small applications natural convection cooling is sufficient, but for the electronic equipment having number of heat generating components, forced convection cooling is essential. In number of cases, pin fin arrangement is preferred for augmentation of heat transfer. Here, the performance of pin fin array of copper and aluminum material with in-line, as well as staggered arrangement over a flat plate is studied. Constant heat input was given to the inline, staggered arrangement of copper as well as aluminium pin fin arrays. In the present experimental study, heat input and airflow rates are the variables. It was found that the heat transfer coefficient for staggered array is 15% more than that of the in-line array, at the same time pressure drop across the staggered array is more by 10% than the in-line array. The pressure drop was observed to be increasing with increase in flow rate as expected. Endeavor of the present work is to find the optimum spacing between the fins in an array for maximum heat transfer rate, by investigating the heat transfer characteristics.