Abstract
Thermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured.
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