Abstract
This work investigates Cu-In alloy at 15% indium for wetting behaviour after heat treatment at 800 ⁰C. The system is observed to show wetting behaviour at triple junction (grain junction) through Scanning electron microscope imaging. It is observed in energy dispersive spectroscopy that after annealing, increased segregation of indium near triple junction is responsible for this wetting behaviour. The current work is critical to development of advanced materials with better mechanical characteristics at high temperatures.
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