Experimental investigation of heat transfer characteristics of the LED module using passive heat sinks

Abstract

ABSTRACT Light-emitting diode (LED) has several advantages and applications due to energy efficiency, versatility, performance, and long life. LED converts only 20–30% of the power input into light, converting the remaining 70–80% of the energy into heat that must be conducted from the LED die to the underlying circuit board, heat sinks, and housings. Improper thermal management will lead to an increase in the junction temperature above the safe limit, thus leading to premature failure of the LED. The present investigation aims to study the variation of case and junction temperature for three types of heat sinks, namely, diagonal, cylindrical, and spiral using 16 W LED. Light output in terms of lux is measured. Experiments were conducted by varying currents from 100 to 300 mA. It was observed that the spiral heat sink has the least junction temperature and thermal resistance among the three heat sinks at all current ratings.