Abstract
Vapor chambers with transformative evaporator wick designs capable of passively dissipating high heat fluxes over large areas, while maintaining low thermal resistances, can meet the thermal management needs of next-generation power semiconductor devices. Our prior work proposed a two-layer evaporator wick structure to enhance the performance of vapor chambers operating at high heat fluxes. The current study experimentally characterizes the capillary-fed boiling heat transfer behavior in such a two-layer evaporator wick, compared to a homogeneous (single-layer) wick, over a 1 cm2 evaporator area. The two-layer design comprises a thin base wick layer that is fed with liquid from a thick cap wick layer above using an array of vertical posts. The two-layer wick is fabricated using a sequence of sintering and laser-machining steps to form the base wick layer (200 µm), array of liquid-feeding posts, and cap wick layer (800 µm) using 90–106 µm copper particles. A test facility is constructed to replicate the conditions that exist at the evaporator of a vapor chamber; the novel facility design uses a physical restriction to prevent flooding of the wicks during testing. Two-layer wicks having 5 × 5 and 10 × 10 arrays of liquid feeding posts are characterized, along with a 200 µm-thick single-layer evaporator wick. The 10 × 10 array provides a >400% enhancement in the dryout heat flux compared to the single-layer wick. High-speed visualizations are used to identify the characteristic regimes of boiling operations for the wicks. The single-layer wick exhibits a partial dryout mode of operation, where a dry spot formed in the center of the heated evaporator area causes an increase in the thermal resistance with heat flux. In contrast, the distributed feeding provided by the two-layer wicks mitigates the development of this partial dryout regime and maintains a constant low resistance (∼0.1 K/W) during capillary-fed boiling until a complete dryout event occurs. This study demonstrates the significant enhancement in dryout heat flux offered by the liquid-feeding approach realized in the two-layer evaporator wicks characterized here.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.