Abstract

Gallium arsenide (GaAs) grown by metallorganic chemical vapor deposition (MOCVD) method and n-doped with silicon to a concentration of 4×10 17 cm −3 was exposed to 200 MeV 107Ag 14+ ion irradiation. The ion fluence was varied from 2×10 8 to 5×10 11 ions cm −2. The modifications in electrical transport behavior of n-GaAs epitaxial layer was studied by employing in situ resistivity and Hall measurements. The resistivity exhibited a slow increase upto a fluence of 1×10 10 ions cm −2, and then increased in a quasi-exponential manner with respect to fluence. The free carrier concentration in the epitaxial layer, as calculated from Hall measurements, initially showed a slow decrease until a fluence of 1×10 10 ions cm −2 is reached. After this fluence, the free carrier concentration decreased quickly with increase in fluence. The carrier mobility also exhibited a similar kind of trend. The observed modifications in transport properties have been explained on the basis of production of defects in n-GaAs epitaxial layer by swift heavy ion irradiation and the resultant trapping of free carriers.

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