Abstract
Ball end Magnetorheological Finishing (BEMRF) is a novel finishing process employed in the finishing of 2D and 3D surfaces. The magnetorheological effect imparted by the magnetic particles introduced through water or other carrier medium governs the finishing action of BEMRF. Abrasive and carrier medium play a vital role in the surface quality of the silicon material exposed to BEMRF process. In the present study, deionized water was used as a carrier medium while cerium oxide acted as an abrasive to finish the silicon wafer. An experimental study through statistical design of experiments were employed to predict the effect of process parameters such as core rotational speed, working gap, and magnetizing current on a percentage reduction in surface roughness of silicon wafer in BEMRF process. Individual effect on surface roughness values in terms of arithmetical mean roughness (Ra) was studied by applying ANOVA. The maximum contribution is made by the working gap on the surface finish was found to be the most critical aspect. Coming next was the magnetizing current while the last contribution was provided by the core rotational speed.
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