Abstract

This article explores the thermal management of three heat sinks with multiple topologies, such as the unfinned heat sink (US1), the square-finned heat sink (SS2) and the metallic porous foam-based heat sink (PFS3). The goal is to enhance their overall performance using smart nanomaterials to strengthen PCMs thermal conductivity with Al2O3/RT70HC, (NsPCM), under different transient heating loads (10–30 W) and varying nanomaterials saturation levels between 0.15 and 0.25 wt%. The results showed that the insertion of NsPCM lowered the bottom temperature of all heat sinks. The thermal performance of PFS3 was even better than US1 and SS2 at all Al2O3 saturation and heating loads, lowering the bottom temperature and achieving critical operational temperatures of 55 °C and 70 °C effectively. PFS3 has the highest surface area to volume ratio, exceptional thermal conductivity, and superior weight advantage compared to pin fin heat sinks. However, other highly conductive metallic foams instead of copper foam may be tested to avoid oxidation with alumina nanomaterials and enhance heat transfer. Therefore, adding nanomaterials into PCM is highly encouraged for sustainable advancement in electronic thermal management.

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