Experimental Investigation and Optimization of Micro-EDMing Process for Silicon Substrates

Abstract

Microelectrical discharge machining of n-type monocrystalline silicon is investigated in this study through a microgrooving process. The pulse duration, pulse frequency, spark current, and gap voltage are varied in the experiments. The groove geometries and roughness are measured together with the material removal rate and electrode wear ratio. The results have shown that a large and deep groove can be made at high machining rate when a high spark energy condition is applied. This can, however, increase the electrode wear ratio as a consequence, making the process inefficient. A multiresponse optimization, using Grey relational analysis, has been applied. The optimum cut result has shown that good cut quality, high material removal rate, and low electrode wear ratio are achievable from this study.