Abstract
This paper deals with the reaction of dense Metastable Intermolecular Composite (MIC) materials, which have a higher density than conventional energetic materials. The reaction of a multilayer thin film of aluminum and copper oxide has been studied by varying the substrate material and thicknesses. The in-plane speed of propagation of the reaction was experimentally determined using a time of- flight technique. The experiment shows that the reaction is completely quenched for a silicon substrate having an intervening silica layer of less than 200 nm. The speed of reaction seems to be constant at 40 m/s for silica layers with a thickness greater than 1 μm. Different substrate materials such as glass and photoresist were also used.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
