Abstract

This paper deals with the reaction of dense Metastable Intermolecular Composite (MIC) materials, which have a higher density than conventional energetic materials. The reaction of a multilayer thin film of aluminum and copper oxide has been studied by varying the substrate material and thicknesses. The in-plane speed of propagation of the reaction was experimentally determined using a time of- flight technique. The experiment shows that the reaction is completely quenched for a silicon substrate having an intervening silica layer of less than 200 nm. The speed of reaction seems to be constant at 40 m/s for silica layers with a thickness greater than 1 μm. Different substrate materials such as glass and photoresist were also used.

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