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Abstract
Adhesively bonded structures are widely used in many engineering fields for new structures and strengthening of existing ones. The failure of these joints are in some cases caused by long-term deformations. In this paper, an in house made experimental setup for investigating the creep behavior of epoxy resin specimens is presented. The test equipment consists of both conventional apparatus and a non-contact optical technique, Digital Image Correlation (DIC). Several tests were performed at different temperatures and the corresponding results were used for creep master curve construction by means of time-temperature superposition principle (TTSP).
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