Abstract
Advancements in power electronics, such as wide band gap semiconductors, are pushing package size reduction and higher power density through higher switching frequency operation, but continued growth requires innovation in the areas of high voltage circuit design and thermal management. High voltage component and circuit design is dictated by creepage and clearance standards for operation in ambient air. This paper presents initial experimental results utilizing an electrically insulating liquid, Cargill FR3, to provide protection against electric field breakdown in submerged electronics. This will allow for new design standards and opportunity for increasing power density and smaller footprints. Second, it is proposed that immersion in the insulating FR3 fluid will also work to improve thermal power dissipation of electronics. Preliminary results of the thermal performance of a heat-sink-free GaN inverter immersed in FR3 are included in this work.
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