Abstract
The direct liquid cooling (DLC) of the data center is becoming popular due to its higher heat removal from the computer chips. The direct liquid cooling method is more effective than the conventional air-cooling system and reduces the higher infrastructure and maintenance costs. The DLC reduces the chip failure rate drastically and increases the life of the data centers. Different liquids can be used as a coolant and some manufacturers are coming up with different coolants where the liquid has high thermal efficiency and is electrically non-conductive. In this article, a heat-transfer cold plate made of aluminum is designed and a different combination of heat-transfer liquids (Distilled water, Ethylene Glycol, and Polyethylene Glycol) is tested to find a comparatively better combination of heat-transfer liquid. It was observed that the combination of Ethylene Glycol and distilled water performs better than other combinations. It was also found that the coolant flow rate plays an important role in the cooling of the chips as well.
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