Abstract
Characterization of thermoelectric modules is critical to validate device models, to compare and optimize fabrication techniques, and to obtain parameters for system design. Four characterization methods found in the literature were compared experimentally for the first time using a single test stand developed to characterize modules over a wide range of temperatures. The test stand incorporates a programmable electronic load that allows for a variety of tests to be performed. A single module was tested using the steady-state, rapid steady-state, Gao Minʼs constant heat rate, and Buistʼs modified Harman methods. Here, we present the differences observed and offer a preliminary explanation for the discrepancies.
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