Abstract
The dynamic crack growth behavior of adhesively bonded joints under mode I and mixed mode (I + II) loading were investigated. The split Hopkinson pressure bar (SHPB) apparatus and the digital image correlation (DIC) technique were employed to determine the mode I fracture toughness of the adhesively bonded joints during crack propagation under impact loading. The dynamic crack growth behavior for carbon fiber reinforced plastics (CFRP) adhesively bonded joints under mode I loading was studied using this method. In order to verify the proposed method, the dynamic crack growth behavior of titanium alloy adhesively bonded joints was also studied. Moreover, the crack growth behavior of CFRP adhesively bonded joints under mixed mode loading was studied using the SHPB technique. For the considered CFRP adhesively bonded joints, the fracture toughness decreased under both mode I and mixed mode loading as the loading rate increased. Microscope observation showed that a shift in the crack location occurred in the high loading tests.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.