Abstract
Recent advancements in microelectronics packaging and fabrication have resulted in high heat flux densities in data center server components. Liquid cooling is increasingly replacing air cooling in data centers because of its high heat carrying capacity. It also provides an energy efficient way to transport heat from processor as compared to air cooling using Computer Room Air Conditioning (CRAC). This study presents the results of a bench level experiment to characterize a commercially available cold plate. The cold plate under consideration is used in Direct Liquid Cooling (DLC) application in data center cooling. Thermal characterization of cold-plate is necessary in order to develop a fundamental understanding of its energy transport which would enable researchers to improve the overall energy-efficiency; reliability and usability of warm water cooling in data centers. The temperature rise (ΔT) across the cold plate and the cold plate surface temperature are measured for various coolant flow rate and chip power. The results are presented in the form of thermal resistance curve. A close estimation of heat transfer coefficient values is then obtained from the resistance values using well-established relations.
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