Abstract
Hybrid and full electric automotive market is strongly increasing the demand for power semiconductor modules. With respect to discrete packages, manufacturing of power modules is more complex and new process parameter, such as module deformation (warpage), assumes a key role for a robust design and to guarantee reliable application. The aim of this paper is to study the warpage behaviour during power module assembly flow by means of dedicated warpage measurement at different process steps. Once highlighted the most impacting process for warpage, a finite element model has been developed to reproduce phenomenology, predicting the induced deformation.
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