Abstract

This research focuses on innovative stealth equipment by integrating a liquid cooling plate and phase change material (PCM), and the temperature rise on the cold surface and PCM melting rate is reported to illustrate the PCM thermal behavior in lifting the heat shielding performance. Results show that the integrated PCM system is effective in delaying the temperature rise within a certain time. A slower temperature rise on the cold surface is found at the first 1200 s, and a significant acceleration in the temperature rise is given within 1200 s ∼ 2000 s as the heat flood breaks through the PCM layer. The PCM melting rate increases rapidly and then rises slowly, and the complete melting time is shortened as increasing heat power. The heat shielding performance is significantly reduced with increasing the liquid flow rate, and the influence of the coolant temperature on the temperature rise becomes more and more prominent as the completion of the PCM melting process. A slower temperature rise is observed at the lower PCM phase transition temperature, and a further increase in the PCM covering layer has little influence on the temperature rise at the initial stage.

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