Abstract
2,2′-Dithiosalicylic acid (DSA), 2-aminophenyl disulfide (APD) and 2,2-dibenzamidodiphenyl disulfide (DPD) were determined for corrosion inhibition of Cu in H2SO4 media by electrochemical tests, surface morphology analysis, quantum chemical calculations and molecular dynamics simulations. The results of polarization curves showed that DSA, APD and DPD reveal good anti-corrosion capacity. They can simultaneously inhibit the cathodic and anodic reactions of copper. Therefore, they belong to the mixed-type corrosion inhibitors. Impedance spectroscopy results showed that when DSA, APD and DPD adsorption on the surface of Cu, the charge transfer resistance increases significantly and typical capacitance behavior produced, which indicates that the formed inhibitor film is very dense and ordered. In addition, the adsorption of corrosion inhibitors on the Cu surface is conforming to Langmuir monolayer adsorption. The experimental results obtained by surface topography analysis are consistent with the results of electrochemical experiments. Their corrosion inhibition ability is DSA < APD < DPD. Theoretical calculations further explore the relationship between corrosion inhibition performance and their molecular configurations.
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