Experimental and theoretical analysis in impedance-based structural health monitoring with varying temperature

Abstract

In the recent years, the piezoelectric wafer active sensors (PWASs) are increasing as a measurement tool in structural health monitoring techniques. In impedance-based structural health monitoring (ISHM) method, the electrical impedance of a PWAS bonded to the structure is measured and served as a defect detection index of the structure. The principle of this method is based on the electromechanical coupling effect of PWAS materials. As any change in the structure will lead to a change in mechanical impedance of structure, the electrical impedance of PWAS could sense this change by the electromechanical coupling effect of PWAS. Since the physical and mechanical properties of PWAS materials are temperature-dependent, so the electrical impedance of PWAS will change with varying temperature. Consequently, the changes in environmental or service temperatures could be detected in ISHM method as a defect. In this article, in order to consider the temperature dependency of PWAS material properties, a temperature-dependent model is developed for a PWAS bonded to an Euler Bernoulli cantilever beam. An aluminum (alloy 2024) beam was examined experimentally by ISHM method in order to validate the proposed model. The comparison of theoretical and experimental results demonstrates a good improvement in ISHM modeling where temperature variation is present.