Abstract
Based on the forward voltage measurement principle, a test device was designed for junction temperature measurement. The voltage temperature coefficient is-1.49mV/°C according to the experimental data, and a series of junction temperatures were obtained on various ambient temperature. A numerical model was built by using the CFD software Flent, which was verified with the experimental data. The influence of the different structure parameters of the heat sink on heat dissipation performance was studied numerically. The results show that the optimal structure parameters were as following: Fin number is within 8~12. Fin height is within 170mm~190mm. Fin length is within 35mm~55mm. Fin thickness is within 1mm~3mm. Bases radius is within 33mm~40mm. With the chip junction temperature and the radiator weight as optimizing object, the optimal parameters were obtained as following: Fin number is 12. Fin height is 190mm. Fin length is 55mm. Fin thickness is 1.5mm. Bases radius is 33 mm.
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