Abstract
Today, electronic device cooling is a significant challenge that has been addressed by utilizing heat sinks with various designs. The numerical and experimental investigation of changes in the wavy channel heat sink height is carried out to improve the performance. As a novelty, the heat sink's height remains constant to assess how open space above the channels affects the performance. The work aims to assess the impact of various heat fluxes and flow rates on temperature, Nu number, flow, and velocity; meanwhile conducting a non-dimensional analysis. At the flowrate of 6.94cm3/s, once the channel's height was reduced to 10 mm, the highest temperature decreased by 7.84%, while by the decrement of height to 7 and 4 mm, it witnessed 14.14% and 23.81% rises, respectively. The local Nusselt number for 10 mm height and 19.56cm3/s flow ranges between 127.47 and 106.53 in 5.17 W/cm2 heat flux. The flow with higher dimensionless velocity is dispersed throughout the open area above the heat sink, once the 12.7 mm height is reduced to 10 mm. The performance evaluation criterion of the system is determined by considering the ratio between Nu number and friction factor, which is obtained between 1.08 and 1.22 for 10 mm channel height. Thus, the 10 mm wavy channel height can be suggested for cooling electrical equipment.
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