Experimental and numerical investigation of heat transfer for two-layered microchannel heat sink with non-uniform heat flux conditions

Abstract

To meet the cooling demand of electronic devices with multiple heat sources, we design two novel two-layer mini-channel heat sinks (3-port structure and 5-port structure) to improve the uniformity of surface temperature distribution. The temperature distribution and fluid flow in the two channel networks with single and two layer structures are investigated. The 5-port mini-channel network is verified to have a lower pressure drop and a better thermal performance compared with the 3-port one in terms of total thermal resistance and surface temperature distribution. For the 5-port 2-layer structure, the local thermal resistance ranges from 0.2 to 0.08 K/W at the flow rate of 400–900 ml/min while the pressure drop is lower than 2.5 kPa.