Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

Bobin Saji George,M Aswin,D Ribin,J Akhil,S R Deepu,M Ajmal,P.B Raghuvir,T.M Mathew

doi:10.1051/matecconf/201814404010

Abstract

Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.

Highlights

The computational power of each electronic component increases drastically leading to shrinking the physical size of the component
The temperature difference between the heater surface and ambient air becomes lesser causing the heat transfer rate to decrease with increase in heat generation
It is very curious to note that for a constant flow, the amount of heat dissipated to air decrease with increase in heat generation

Summary

Introduction

The computational power of each electronic component increases drastically leading to shrinking the physical size of the component. Whenever current is passed through a conductor heat is produced in it because of the resistance of the conductor. This will happen as such in the case of electronic component . An insufficient removal of heat can result in temperatures above the equipment operational limits. In these circumstances, the performance, the life and the reliability of the equipment are extremely reduced. Without proper design and control, high rate of heat generation result in high operating temperature for electronic equipment, which reduces the safety and reliability

Methods

Results

Conclusion