Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

M.-K Shih, G.-S Lin + Show 3 more

https://doi.org/10.1007/s40799-023-00679-5

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Journal: Experimental Techniques	Publication Date: Oct 27, 2023
Citations: 1

Abstract

Experimental and Numerical Investigation of Delamination Between Epoxy Molding Compound (EMC) and Metal in Encapsulated Microelectronic Packages

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