Abstract
Graphite is expected to be a common choice for basic microelectromechanical-system (MEMS) material in the future. However, in order to become a basic MEMS material, it is very important for graphite to be adapted to the commonly-used micro-/nanoprocessing technology. Therefore, this paper used a directly lithography and etching process to study micro-, /nanoprocessing on graphite. The results show that the graphite surface is suitable for lithography, and that different shapes and sizes of photoresist patterns can be directly fabricated on the graphite surface. In addition, the micro-meter height of photoresist could still resist plasma etching when process nanometers height of graphite structures. Therefore, graphite with photoresist patterns were directly processed by etching, and nanometer amounts of graphite were etched. Moreover, micro-/nanoscale graphite structure with height ranges from 29.4 nm–30.9 nm were fabricated with about 23° sidewall.
Highlights
With the continuous maturity of micro-/nanoprocessing technology, microelectromechanical systems (MEMS) with silicon as the basic material have been rapidly developed, and are used in aviation, biological, medical, and other fields [1,2,3]
The graphite micro-/nanostructures was characterized by Photoresist patterns were directly processed on the graphite surface based on the aforementioned atomic-force and scanning-electron microscopy
The results show that graphite can be directly processed by lithography different graphite
Summary
With the continuous maturity of micro-/nanoprocessing technology, microelectromechanical systems (MEMS) with silicon as the basic material have been rapidly developed, and are used in aviation, biological, medical, and other fields [1,2,3]. MEMS materials to meet the special needs of different applications. Flexible materials such as polydimethylsiloxane and polyimide film have been investigated and used as basic materials in preparing flexible and wearable MEMS devices [4,5,6]. High tensile-strength material has been invented, such as the nickel–molybdenum–tungsten alloy, which is a strong material invented by Kevin. J. Hemker’s team at Johns Hopkins University. It has good tensile and high-temperature resistance to meet the demand for MEMS to work in harsh environments [7]. With the continuous expansion of the scope and field of MEMS applications, researching for new basic MEMS materials, suitable for different application fields, is receiving increasing attention
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