Abstract
Abstract Micro-machined multilayered structure plays a significant role as sensing or actuating components in MEMS. Since different thermal expansion parameters and uneven cooling processes in anodic bonding films, it is important to analyze and measure residual stress of the multi-layer glass/aluminum anodic bonding in the cooling process. In this paper, experiments of three-layer, five-layer glass and aluminum anodic bonding samples were made by the public anode method at 400 °C, 600 V and 0.05∼1 MPa for 15 min. Chemical element analysis of the transition layer formed between glass and aluminum during anodic bonding process was analyzed by Energy Dispersive Spectrometry (EDS). Subsequently, residual stresses and strains in cooled three-layer, five-layer and seven-layer anodic bonding samples was analyzed using nonlinear finite element simulation software MARC. Finite element analysis showed that the residual stress and strain distribution in different multi-layer glass and aluminum samples was similar. Simultaneously, finite element analysis indicated that three-layer glass and aluminum anodic bonding samples had smallest residual stress and equivalent strain values in all samples, an important advantage in MEMS fabrication.
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