Abstract
Extending the data transfer rates through dense interconnections at inter‐ and intraboard levels is a well‐established technique especially in consumer electronics at the expense of more cross talk, electromagnetic interference (EMI), and power dissipation. Optical transmission using optical fibre is practically immune to the aforementioned factors. Among the manufacturing methods, UV laser ablation using an excimer laser has been repeatedly demonstrated as a suitable technique to fabricate multimode polymer waveguides. However, the main challenge is to precisely control and predict the topology of the waveguides without the need for extensive characterisation which is both time consuming and costly. In this paper, the authors present experimental results of investigation to relate the fluence, scanning speed, number of shots, and passes at varying pulse repetition rate with the depth of ablation of an acrylate‐based photopolymer. The depth of ablation essentially affects total internal reflection and insertion loss, and these must be kept at minimum for a successful optical interconnection on printed circuit boards. The results are then used to predict depth of ablation for this material by means of adaptive neurofuzzy inference system (ANFIS) modelling. The predicted results, with a correlation of 0.9993, show good agreement with the experimental values. This finding will be useful in better predictions along with resource optimisation and ultimately helps in reducing cost of polymer waveguide fabrication.
Highlights
Consumer electronics are experiencing uphill challenge to overcome high-frequency (>10 Gb/s) transmission problems such as cross talk, electromagnetic interference, and power dissipation especially with high interconnectivity [1]
An optically enabled printed circuit board is a viable solution as this technique has been successfully used for long haul communications, that is, optical fiber
Laser ablation is the preferred technique for fabrication primarily due to its proven use as well as availability with PCB manufacturers [1, 2]
Summary
Consumer electronics are experiencing uphill challenge to overcome high-frequency (>10 Gb/s) transmission problems such as cross talk, electromagnetic interference, and power dissipation especially with high interconnectivity [1]. Rush for miniaturization, addition of more features/applications, and communication at microscales (e.g., chip-to-chip) have exposed the limits of copper-based transmissions in electronic circuits. To overcome this bottleneck, an optically enabled printed circuit board is a viable solution as this technique has been successfully used for long haul communications, that is, optical fiber. The optical interconnections (OIs), used in conjunction with copper connection forming electric-optical bridge, are usually made up of polymer waveguides. Various fabrication techniques of these polymer waveguides have been proposed including laser direct writing, photolithography, inkjet printing, and laser ablation [2]. Laser ablation is the preferred technique for fabrication primarily due to its proven use as well as availability with PCB manufacturers [1, 2]
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
