Abstract

Experience with polymer thick film technology: Raimo Hukkonon, Eero Jarvinen and Vesa Sortti Electrocomponent Sci. Technol. 10, 135 (1983)

Highlights

  • Polymer thick film technology is a printed circuit manufacturing method, in which polymer resin based conductor, resistor and insulator materials are screen-printed, dried and cured directly on the circuit board

  • The polymer pastes used in the test circuits were from Electro Materials Corporation of America (EMCA), Electro Science Laboratories (ESL)and Methode Development Company

  • The resistor materials from EMCA and ESL are sensitive to the substrate material, but in relation to each other they behave very much in the same way

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Summary

INTRODUCTION

Polymer thick film technology is a printed circuit manufacturing method, in which polymer resin based conductor, resistor and insulator materials are screen-printed, dried and cured directly on the circuit board. This technology has its effects on size, reliability and productions costs of electronic equipment, by increasing integration, decreasing the number of solder joints and making the automatic insertion of other components easier and more efficient. To get personal experience and understanding of polymer resistor technology a research project was carried out at the Technical Research Centre of Finland, Electronics Laboratory during the years 1979 and 1980. The results of this study are presented and discussed in this paper

INITIAL TESTS
Description of the Test Orcuits
Test Program
Substrate Effect
Results from the Applied Tests
20 EMCA 1913
Effect ofSoMering Temperature
Differential Thermo Analysis
CONCLUSION
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