Abstract
This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages.
 An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study aims to solve huge amount of compound material disposed in the manufacturing line.
 By challenging the current 24hours suppliers thawing time, it is shown that at 16hours thawing time, molding compound already reached the required room temperature (23°C ± 3°C). To maximize the usage window of molding compound, the existing floor life of 24hrs was also reviewed and after experiment, it was found out that it can still be extended to another 24hrs or 48hrs total floor lifetime.
 Combining the 2 improvements, a total of 56hrs usage window for the molding compound from 24hrs usage window.
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